W50 tungsten copper plate is composed of 55% W and 45% Cu, which not only has high density (11.85g/cm3), high hardness (≥HB115), high strength, but also has good conductivity (%54IACS), softening temperature is ≥900℃.
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W55 tungsten copper plate picture
W55 tungsten copper plate has similar properties to W50, it has high content of Cu and low content of W. It is relatively soft, but the plasticity and conductivity is excellent. So it is suitable for the occasions have high requirements of electrical and thermal conductivity, such as contacts, contact tips and related accessories.
