Mo-Cu heat sinks are advanced thermal management materials combining molybdenum’s strength and stability with copper’s excellent thermal conductivity. They offer a low thermal expansion coefficient and are widely used in high-power semiconductors, microwave modules, and aerospace electronics. Mo-Cu heat sinks effectively lower chip temperatures and enhance device reliability. Through powder metallurgy, the Mo-Cu ratio can be adjusted to meet specific thermal requirements, with custom sizes and shapes available for various applications.
