Tungsten-copper heat sinks are composite materials that combine high thermal conductivity with a low coefficient of thermal expansion. They are widely used in high-power electronic devices, RF and microwave components, IGBT modules, and aerospace electronic packaging. Composed primarily of high-density tungsten and highly conductive copper, these heat sinks ensure excellent heat dissipation while maintaining good mechanical strength and high-temperature stability.
With high thermal conductivity and a low thermal expansion coefficient, tungsten-copper heat sinks effectively prevent thermal stress mismatch, enhancing the reliability of electronic packaging.
